Dicing (Tape frame) Wafer Surface Inspection System
YPI-MX TF
Laser inspection system for unpatterned dicing wafer with tape frame.
For develop & pilot process lines.
Spec
| Model | YPI-MN |
|---|---|
| Loading type | Manual loading |
| Dimension | (W)1220 x (D)1220 x (H)1810mm |
| Utility (Power) | AC200V |
| Utility (Vacuum) | -70kPa -40kPa |
| Wafer type | Tape frame wafer & Wafers |
| Wafer size | 4 to 12inch wafer 6 to 12inch tape frame wafer |